Teardown: Movespeed MSP08Pro 10000mAh Magnetic Wireless Power Bank ā iSmartWare SW6236 SoC, Southchip SC5008
2026-09-16 Ā· Compiled by Best IT Parts from public industry reporting
A teardown of the Movespeed MSP08Pro, a 10000mAh magnetic wireless power bank, shows a semi-solid-state cell paired with a four-port power bank SoC and a dedicated wireless charging power stage. The cell is an MLS Marathon 136280 semi-solid-state pouch rated 3.85V and 38.5Wh, described as passing nail-penetration and hot-press testing, with a rated capacity of 6000mAh at 5V/2A. The housing measures about 102.12mm x 66.90mm x 16.60mm and carries 3C, CE and FCC marks.
The main controller is iSmartWare's SW6236, an A+A+C+C multi-protocol power bank SoC. It integrates a 5A switching charger and a 22.5W synchronous boost output rated at up to 95.73% efficiency, with standby current below 40ĀµA at 3.7V. The part supports PD/PPS, QC, SCP, FCP, AFC, PE and BC1.2, works with 3.6V/3.65V lithium iron phosphate as well as 4.2-4.5V ternary cells, and includes an I2C interface, a coulomb counter and a 12-bit ADC for 3-5 LED fuel gauges. Protections cover OVP, OCP, UVP, OTP, CTP and NTC.
Wireless charging uses a controller marked 253302L plus Southchip's SC5008, a 15W full-bridge transmitter power stage in a 3mm x 4mm QFN. It integrates the full bridge with low-resistance MOSFETs, gate drivers, 5V and 3.3V LDOs, a communication demodulator and input current sensing, and meets WPC V1.3.2 baseline and extended power profiles. Foreign object detection relies on a current-sense amplifier, with UVLO, OCP, SCP and OTP also on board. Resonant-capacitor switching uses an APM AP30N03DF, a 30V MOSFET with 18mĪ© on-resistance in a PDFN3x3 package.
Wired I/O is two bidirectional USB-C ports rated 5V/3A, 9V/2.22A, 10V/2.25A and 12V/1.67A output at 22.5W maximum; wireless output steps through 5W, 7.5W, 10W and 15W. The cell carries an NTC thermistor for temperature monitoring and connects to the board by laser spot welding, with a full-bridge boost inductor, battery protection ICs and VBUS FETs completing the assembly.
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Technical details are reproduced as reported. Verify specifications against the original source before design or procurement decisions.