AVIC Optoelectronics Develops High-Performance Cold Plate to Support 2500W AI Chip Thermal Demands
2026-07-31 · Compiled by Best IT Parts from public industry reporting
At OCP China Day 2026, AVIC Optoelectronics unveiled its independently developed liquid-cooled cold plate thermal solution engineered to handle the extreme heat dissipation requirements of next-generation 2500W AI processors. As AI training clusters scale to unprecedented power densities, advanced thermal management has become a critical bottleneck for data center operators and server OEMs. The solution utilizes a precision-machined micro-channel cold plate design with optimized coolant flow paths to achieve superior thermal conductivity and uniform heat distribution across the chip surface — offering a key reference for IT parts wholesalers and data center infrastructure suppliers tracking AI-era cooling technology evolution.
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